Electrical & Electronics Device Development Jobs in Japan
42 open permanent device development roles at 12 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
42 open permanent device development roles at 12 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
Free to join. Set your terms, stay hidden, and hear only from roles that state them.
Daily total across the 10 companies tracked through the whole period. Companies added mid-period are excluded until the window catches up to them. As of October 8, 2026 · tracked daily since August 1, 2026
Device Development, all industries · 38 postings with comparable stated pay, from 16 employers
median ¥7,800,000 · 38 postings
¥6,300,000
Typical advertised range
¥10,400,000
Postings by Advertised Range
¥4M–5.9M
1
¥6M–7.9M
18
¥8M–9.9M
14
How hiring on this page compares with its wider market, on the same measures.
Compared with Electrical & Electronics employers across Japan (52 companies).
Counts on this page come from AirTA's own daily checks of each company's careers page. When a number cannot be measured reliably, it is hidden rather than estimated. Industry describes the company, not the individual role, so an employer with several businesses appears under each industry it operates in. Report a data issue.
| F15 ADTJ PI Device Engineer | Micron Technology |
| Advanced CMOS Device & Process Integration Engineer | Micron Technology |
| Advanced CMOS Device & Process Integration Engineer | Micron Technology |
| Advanced CMOS Device & Process Integration Engineer | Micron Technology |
| 【903】原子炉関連機器の設計・開発(日立ＧＥベルノバ＊へ出向) | Hitachi |
| 【2766】最先端半導体パッケージ実装に関する構造信頼性の解析技術の研究開発 | Hitachi |
| 【899】高速炉に関する安全設計・炉心及び系統設計業務（日立ＧＥベルノバ＊へ出向） | Hitachi |
| 表面分析装置（オージェ電子分光装置/光電子分光装置）の製品開発/技術開発 | JEOL |
| パワーデバイス開発エンジニア | Renesas Electronics |
| パワーデバイス開発エンジニア | Renesas Electronics |
| F15 ADTJ PI Device Engineer | Micron Technology |
| 《大阪府(門真)or東京都(虎ノ門)》電子デバイスのMBD推進・シミュレーション技術開発【PID デバイスソリューション事業部】 | Panasonic |
| 高周波部品開発エンジニア | Huawei Technologies |
| [船橋] 光学エンジニア【光学構造設計】 | Huawei Technologies |
| [船橋]レンズ関連エンジニア-機能性コーティング開発・光通信用光学部品のプロセス開発・車載部品コーティング開発・機能性材料開発者・LENS射出成形金型設計・光学金型アーキテクト【6名募集】 | Huawei Technologies |
| [船橋] 光電モジュール 先進パッケージングエンジニア | Huawei Technologies |
| [船橋]レンズ関連エンジニア-金型設計者・光学部品開発エンジニア【2名募集】 | Huawei Technologies |
| 機器開発エンジニア(エレクトロニクス) | itec |
| 機器開発エンジニア(エレクトロニクス) <プロダクト開発リード> | itec |
| 医用機器のシステム設計（画質と臨床応用） | Canon |
| 《洲本/徳島》 リチウムイオン電池の開発（評価解析）【PEC エナジーソリューション事業部】 | Panasonic |
¥10M–11.9M
2
¥12M–13.9M
2
¥14M–15.9M
0
¥16M+
1
Electrical & Electronics Device Development-specific pay is hidden: 23 postings state pay, but too few employers disclose to describe a market. Figures appear when enough employers disclose.
| Roles closed per employer (30 days) | Not enough postings on this page to compare. | ||
| Median days a role stays open | Not enough postings on this page to compare. | ||
| Postings stating a salary | 55% | 58% |
| Median advertised salary | Not enough postings on this page to compare. | ||
| Classified postings requiring English (E1 or above) | 43% | 44% |
| Classified postings needing daily English (E3 or above) | 17% | 16% |
| Management-level titles | Not enough postings on this page to compare. | ||
Counts are per-employer averages; shares are across all live postings on October 7, 2026. English rows use the English-level classification (a subset of postings), so they differ from the share of postings mentioning English in the Market Snapshot. A row is hidden when either side has too few postings to compare fairly.