Electrical & Electronics Process Engineering Jobs in Japan
115 open permanent process engineering roles at 13 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
115 open permanent process engineering roles at 13 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
Micron Technology accounts for 40% of open roles here.
Micron Technology posts the most Process Engineering roles here: 46 of 115 across 13 employers, ahead of Renesas Electronics (24).
Postings here state remote or hybrid work in 10% of cases, against 27% across all tracked postings.
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Daily total across the 13 companies tracked through the whole period. Companies added mid-period are excluded until the window catches up to them. As of October 13, 2026 · tracked daily since August 1, 2026
Process Engineering, all industries · 114 postings with comparable stated pay, from 33 employers
median ¥7,500,000 · 114 postings
¥5,500,000
Typical advertised range
¥9,600,000
Postings by Advertised Range
¥4M–5.9M
26
¥6M–7.9M
37
¥8M–9.9M
43
How hiring on this page compares with its wider market, on the same measures.
Compared with Electrical & Electronics employers across Japan (52 companies).
Counts on this page come from AirTA's own daily checks of each company's careers page. When a number cannot be measured reliably, it is hidden rather than estimated. Industry describes the company, not the individual role, so an employer with several businesses appears under each industry it operates in. Report a data issue.
| AT-D3【兵庫】化合物半導体のプロセス開発エンジニア（GaN/SiC） ／ 東芝デバイス＆ストレージ | Toshiba |
| AT-P2【石川】パワー半導体のユニットプロセス開発エンジニア／ 東芝デバイス＆ストレージ | Toshiba |
| AT-P2【兵庫】ディスクリート半導体のプロセス開発エンジニア（パワーデバイスのユニットプロセス） ／ 東芝デバイス＆ストレージ | Toshiba |
| I&C (Instrumental and Control) Engineer | Micron Technology |
| Staff Engineer, Advanced Development Process and Equipment, Dry Etch | Micron Technology |
| Fab15 PEE CMP Process Sustaining Engineer-1 | Micron Technology |
| 846_タイミングデバイスの新製品要素開発(プロセス技術開発) 【半導体・水晶】 | Seiko Epson |
| Install Productivity Engineer - IMP | Applied Materials |
| EPI Process Support Engineer II | Applied Materials |
| VSE Process Support Engineer II | Applied Materials |
| CIS PDK Development Engineer/Expert | Huawei Technologies |
| RF SOI Process Expert | Huawei Technologies |
| 機能性薄膜成膜技術エキスパート | Huawei Technologies |
| 物理プロセス開発・化学分析技術者（半導体露光装置・FPD露光装置） | Canon |
| 化学プラントの機械・電気計装設計 | Canon |
| 物理・化学エンジニア（レーザービームプリンタのプロセス開発） | Canon |
| 機械系プラントエンジニア（国内サーマルエナジー／建設エンジニアリング業務） | Toshiba |
| gcO143 磁気センサビジネスグループ ATFオペレーション統括部 プロセス技術部 | TDK |
| gcO144 磁気センサビジネスグループ ATFオペレーション統括部 プロセス技術部 | TDK |
| gc4024 生産本部 SCMグループ ロジスティクス部 プロセス改革課 | TDK |
| gcO142 磁気センサビジネスグループ ATFオペレーション統括部 プロセス技術部 | TDK |
¥10M–11.9M
4
¥12M–13.9M
4
Electrical & Electronics Process Engineering-specific pay is hidden: 24 postings state pay, but too few employers disclose to describe a market. Figures appear when enough employers disclose.
| Roles closed per employer (30 days) | Not enough postings on this page to compare. | ||
| Median days a role stays open | Not enough postings on this page to compare. | ||
| Postings stating a salary | 21% | 58% |
| Median advertised salary | Not enough postings on this page to compare. | ||
| Classified postings requiring English (E1 or above) | 43% | 43% |
| Classified postings needing daily English (E3 or above) | 8% | 15% |
| Management-level titles | Not enough postings on this page to compare. | ||
Counts are per-employer averages; shares are across all live postings on October 12, 2026. English rows use the English-level classification (a subset of postings), so they differ from the share of postings mentioning English in the Market Snapshot. A row is hidden when either side has too few postings to compare fairly.