Electrical & Electronics Hardware Engineering Jobs in Japan
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
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Build ResumeDaily total across the 16 companies tracked through the whole period. Companies added mid-period are excluded until the window catches up to them. As of October 13, 2026 · tracked daily since August 1, 2026
Electrical & Electronics Hardware Engineering · 45 postings with comparable stated pay, from 10 employers
median ¥8,000,000 · 45 postings
¥5,300,000
Typical advertised range
¥9,600,000
Postings by Advertised Range
¥4M–5.9M
2
¥6M–7.9M
19
¥8M–9.9M
20
How hiring on this page compares with its wider market, on the same measures.
Compared with Electrical & Electronics employers across Japan (52 companies).
Counts on this page come from AirTA's own daily checks of each company's careers page. When a number cannot be measured reliably, it is hidden rather than estimated. Industry describes the company, not the individual role, so an employer with several businesses appears under each industry it operates in. Report a data issue.
| BT-D6【神奈川】HDD製品開発（ヘッド・メディア）/評価・信頼性検証／ 東芝デバイス＆ストレージ | Toshiba |
| 【府中】空港フィールド機器の設計・開発業務 | Toshiba |
| BT-D5【神奈川】HDD製品開発（ヘッド・メディア）/評価・信頼性検証／ 東芝デバイス＆ストレージ | Toshiba |
| AT-E1【神奈川】アナログIC設計開発エンジニア ／ 東芝デバイス＆ストレージ | Toshiba |
| AT-P1【石川】パワー半導体のデバイス設計・プロセスインテグレーションエンジニア ／ 東芝デバイス＆ストレージ | Toshiba |
| AT-L1【神奈川】マイコン・システム LSIの設計エンジニア ／ 東芝デバイス＆ストレージ | Toshiba |
| AT-N1【神奈川】マイコン・システム LSIのデジタル設計エンジニア ／ 東芝デバイス＆ストレージ | Toshiba |
| BT-Y6【神奈川】サーボ制御開発＿HDD（アルゴリズム設計）／ 東芝デバイス＆ストレージ | Toshiba |
| Sr. Mobile System Engineer | Micron Technology |
| 859_インクジェットプリントヘッド駆動回路設計および商品化企画設計 | Seiko Epson |
| 688_インクジェットヘッドの吐出制御特性開発（外販向け・次世代ヘッド） | Seiko Epson |
| 828_クロックバッファ/ジェネレータICのデバイス開発【半導体】 | Seiko Epson |
| 827_インクジェットヘッド向けプリントチップの撥水膜開発 | Seiko Epson |
| 800_インクジェットプリントヘッドの薄膜ピエゾアクチュエータ要素技術開発 | Seiko Epson |
| 585_インクジェットヘッドのアクチュエーターアセンブリ要素開発 | Seiko Epson |
| 824_インクジェットヘッドデバイスの薄膜圧電素子開発 | Seiko Epson |
| 【理工系学科卒（物理学、電気・電子系学科）の方歓迎】X線分析装置（EDS）の検出器開発 | JEOL |
| Radio HW Digital Design | Ericsson |
| Radio HW Design Power Amplifier | Ericsson |
| Radio HW TRX Design | Ericsson |
| Equipment Development Engineer | Intel |
¥10M–11.9M
2
¥12M–13.9M
0
¥14M–15.9M
2
| Roles closed per employer (30 days) | Not enough postings on this page to compare. | ||
| Median days a role stays open | Not enough postings on this page to compare. | ||
| Postings stating a salary | 34% | 58% |
| Median advertised salary | ¥8,000,000 | ¥8,300,000 |
| Classified postings requiring English (E1 or above) | 35% | 43% |
| Classified postings needing daily English (E3 or above) | 9% | 15% |
| Management-level titles | Not enough postings on this page to compare. | ||
Counts are per-employer averages; shares are across all live postings on October 12, 2026. English rows use the English-level classification (a subset of postings), so they differ from the share of postings mentioning English in the Market Snapshot. A row is hidden when either side has too few postings to compare fairly.