Electrical & Electronics Hardware Engineering Jobs in Japan
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
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- 131
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Electrical & Electronics Hardware Engineering Jobs in Japan
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
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Start from duty lines written from real Hardware & R&D Engineering job postings in Japan. Add your details, then download both documents.
Build ResumeDaily total across the 16 companies tracked through the whole period. Companies added mid-period are excluded until the window catches up to them. As of October 13, 2026 · tracked daily since August 1, 2026
Electrical & Electronics Hardware Engineering · 45 postings with comparable stated pay, from 10 employers
median ¥8,000,000 · 45 postings
¥5,300,000
Typical advertised range
¥9,600,000
Postings by Advertised Range
¥4M–5.9M
2
¥6M–7.9M
19
¥8M–9.9M
20
How hiring on this page compares with its wider market, on the same measures.
Compared with Electrical & Electronics employers across Japan (52 companies).
Counts on this page come from AirTA's own daily checks of each company's careers page. When a number cannot be measured reliably, it is hidden rather than estimated. Industry describes the company, not the individual role, so an employer with several businesses appears under each industry it operates in. Report a data issue.
| [船橋] 光集積回路の設計エンジニア | Huawei Technologies |
| Innovative optical architecture design Expert | Huawei Technologies |
| CIS Pixel Design Engineer/Expert | Huawei Technologies |
| [船橋] 光集積回路の設計専門家 | Huawei Technologies |
| アナログ設計/LSI開発エンジニア(CMOSイメージセンサを代表とする半導体デバイス) | Canon |
| 光学システム設計技術者(半導体露光装置 /ディスプレイ露光装置) | Canon |
| インクジェットデバイスの設計者、開発者 | Canon |
| イメージングデバイスの実装技術開発エンジニア | Canon |
| 避雷器の開発設計業務 | Toshiba |
| 原子力関連施設向け放射線モニタシステムの設計 | Toshiba |
| gcXC35 技術・知財本部 応用製品開発センター スピントロニクス開発部 | TDK |
| データセンター、AIサーバーの電源供給ネットワーク(PDN)に関する電子部品を活用した新たな電子部品ソリューションの設計、仕様検討、社内外パートナーとのプロセス構築。 | Kyocera |
| 《奈良(大和郡山)》エネルギーDX化における計測デバイスのハードウエア・システム開発リーダー【PEW 電材&くらしエネルギー事業部】 | Panasonic |
| 《奈良(大和郡山)》エネルギーDX化における計測デバイスのハードウエア・システム開発【PEW 電材&くらしエネルギー事業部】 | Panasonic |
| 《群馬県》業務用空調コントローラ(リモコン、集中制御機器)の電装ハード開発・設計【PHCCS CAC事業部】 | Panasonic |
| 《奈良(大和郡山)》エネルギーDX化における海外向けスマートメータのハードウエア開発【PEW 電材&くらしエネルギー事業部】 | Panasonic |
| 《奈良(大和郡山)》エネルギーDX化におけるスマートメータのハードウエア開発【PEW 電材&くらしエネルギー事業部】 | Panasonic |
| High-Speed I/F Subsystem Design Leader | Renesas Electronics |
| Principal Engineer of SoC/MCU Architecture | Renesas Electronics |
| SoC RTL Verification Engineer/Leader | Renesas Electronics |
| High-Speed SerDes Interface Evaluation Leader | Renesas Electronics |
¥10M–11.9M
2
¥12M–13.9M
0
¥14M–15.9M
2
| Roles closed per employer (30 days) | Not enough postings on this page to compare. | ||
| Median days a role stays open | Not enough postings on this page to compare. | ||
| Postings stating a salary | 34% | 58% |
| Median advertised salary | ¥8,000,000 | ¥8,300,000 |
| Classified postings requiring English (E1 or above) | 35% | 43% |
| Classified postings needing daily English (E3 or above) | 9% | 15% |
| Management-level titles | Not enough postings on this page to compare. | ||
Counts are per-employer averages; shares are across all live postings on October 12, 2026. English rows use the English-level classification (a subset of postings), so they differ from the share of postings mentioning English in the Market Snapshot. A row is hidden when either side has too few postings to compare fairly.