Electrical & Electronics Hardware Engineering Jobs in Japan
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
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Build ResumeDaily total across the 16 companies tracked through the whole period. Companies added mid-period are excluded until the window catches up to them. As of October 13, 2026 · tracked daily since August 1, 2026
Electrical & Electronics Hardware Engineering · 45 postings with comparable stated pay, from 10 employers
median ¥8,000,000 · 45 postings
¥5,300,000
Typical advertised range
¥9,600,000
Postings by Advertised Range
¥4M–5.9M
2
¥6M–7.9M
19
¥8M–9.9M
20
How hiring on this page compares with its wider market, on the same measures.
Compared with Electrical & Electronics employers across Japan (52 companies).
Counts on this page come from AirTA's own daily checks of each company's careers page. When a number cannot be measured reliably, it is hidden rather than estimated. Industry describes the company, not the individual role, so an employer with several businesses appears under each industry it operates in. Report a data issue.
| ARM CPU Subsystem Design Leader | Renesas Electronics |
| Next-gen Automotive SOC/MCU Test technology development Engineer | Renesas Electronics |
| HPC CPU Subsystem Engineering Manager | Renesas Electronics |
| HPC High-Speed SerDes Interface Evaluation Leader | Renesas Electronics |
| HPC SoC Timing Design Engineer/Leader | Renesas Electronics |
| ARM CPU Subsystem Design Leader | Renesas Electronics |
| Sr Staff SoC Application Engineering (カメラSWフレームワーク) | Renesas Electronics |
| Sr Staff Engineer, Test Jig Core Technology Development | Renesas Electronics |
| 国内・海外太陽光発電所のシステム設計 | Sharp |
| ASIC開発 | Sharp |
| 国内・海外太陽光発電所のシステム設計 | Sharp |
| LEO/MEO衛星向け地上局用アンテナの開発及び端末の開発 | Sharp |
| 通信用SoCの開発強化（通信用SoCの製品開発） | Sharp |
| Principal / Senior / Engineer, TCAD DRAM | Micron Technology |
| LPDRAM Product Engineer | Micron Technology |
| Photolithography 設備エンジニア (DUV Scanner) | Micron Technology |
| Semiconductor Principal Design Engineer | Micron Technology |
| NAND Designer / Layout | Micron Technology |
| SMTS, Design Rule Enablement Team TPG | Micron Technology |
| Photolithography Scanner DUV Equipment Engineer | Micron Technology |
| LPDRAM Product Engineer | Micron Technology |
¥10M–11.9M
2
¥12M–13.9M
0
¥14M–15.9M
2
| Roles closed per employer (30 days) | Not enough postings on this page to compare. | ||
| Median days a role stays open | Not enough postings on this page to compare. | ||
| Postings stating a salary | 34% | 58% |
| Median advertised salary | ¥8,000,000 | ¥8,300,000 |
| Classified postings requiring English (E1 or above) | 35% | 43% |
| Classified postings needing daily English (E3 or above) | 9% | 15% |
| Management-level titles | Not enough postings on this page to compare. | ||
Counts are per-employer averages; shares are across all live postings on October 12, 2026. English rows use the English-level classification (a subset of postings), so they differ from the share of postings mentioning English in the Market Snapshot. A row is hidden when either side has too few postings to compare fairly.