Electrical & Electronics Hardware Engineering Jobs in Japan
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
131 open permanent hardware engineering roles at 18 electrical & electronics companies in Japan, tracked daily from each company's own careers page.
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Build ResumeDaily total across the 16 companies tracked through the whole period. Companies added mid-period are excluded until the window catches up to them. As of October 13, 2026 · tracked daily since August 1, 2026
Electrical & Electronics Hardware Engineering · 45 postings with comparable stated pay, from 10 employers
median ¥8,000,000 · 45 postings
¥5,300,000
Typical advertised range
¥9,600,000
Postings by Advertised Range
¥4M–5.9M
2
¥6M–7.9M
19
¥8M–9.9M
20
How hiring on this page compares with its wider market, on the same measures.
Compared with Electrical & Electronics employers across Japan (52 companies).
Counts on this page come from AirTA's own daily checks of each company's careers page. When a number cannot be measured reliably, it is hidden rather than estimated. Industry describes the company, not the individual role, so an employer with several businesses appears under each industry it operates in. Report a data issue.
| HPC SoC Interconnect Design Engineer / Leader | Renesas Electronics |
| HPC DDR Controller Design Engineer / Leader | Renesas Electronics |
| 障がい者向け エンジニア 職（NAND設計職）*Disability | Micron Technology |
| Principal Physical Design Engineer | Renesas Electronics |
| Principal Timing Design Engineer | Renesas Electronics |
| 《草津》エアコンの商品開発における機能制御設計リーダー【PHCC エアコン事業部】 | Panasonic |
| 《草津》エアコンの商品開発における機能設計・開発業務【PHCC エアコン事業部】 | Panasonic |
| 《草津》エアコンの商品開発における機能制御設計エンジニア【PHCC エアコン事業部】 | Panasonic |
| Radio Hardware Integration Engineer | Ericsson |
| 【第二新卒歓迎】電子ビーム金属3Dプリンターのシステム設計 | JEOL |
| 電子ビーム金属3Dプリンターのシステム設計 | JEOL |
| Staff, Technical Standards – RISC-V SOC (Korea/Taiwan/Singapore/Japan Remote) | Qualcomm |
| High-Speed I/F Engineering Manager | Renesas Electronics |
| HPC High-Speed I/F Engineering Manager | Renesas Electronics |
| 医療イメージング製品の光学エンジニア | Canon |
| Interconnect Model Development/Support CAD Staff Engineer/Senior Engineer | Micron Technology |
| BT-R7-1【神奈川】サーボ制御開発＿HDD（制御設計・先行技術開発）／ 東芝デバイス＆ストレージ | Toshiba |
| TFT Circuit Design Expert | Huawei Technologies |
| Developer Thermal Design | Ericsson |
| 自由視点映像システム向けFPGA、制御ファーム開発者 | Canon |
| BT-R8-1【神奈川】次世代HDD向けRW（Read/Write）技術開発エンジニア／ 東芝デバイス＆ストレージ | Toshiba |
¥10M–11.9M
2
¥12M–13.9M
0
¥14M–15.9M
2
| Roles closed per employer (30 days) | Not enough postings on this page to compare. | ||
| Median days a role stays open | Not enough postings on this page to compare. | ||
| Postings stating a salary | 34% | 58% |
| Median advertised salary | ¥8,000,000 | ¥8,300,000 |
| Classified postings requiring English (E1 or above) | 35% | 43% |
| Classified postings needing daily English (E3 or above) | 9% | 15% |
| Management-level titles | Not enough postings on this page to compare. | ||
Counts are per-employer averages; shares are across all live postings on October 12, 2026. English rows use the English-level classification (a subset of postings), so they differ from the share of postings mentioning English in the Market Snapshot. A row is hidden when either side has too few postings to compare fairly.